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ASE Technology Holding Co., Ltd. engages in the provision of semiconductor manufacturing services in assembly and test. The firm develops and offers turnkey solutions for the front-end engineering test, wafer probing and final test, as well IC packaging, materials and electronic manufactures services. Read More It operates through the following segments: Packaging, Testing, Electronic Manufacturing Services (EMS), Estate, and Others. The Packaging segment offers a broad range of package types such as flip-chip BGA, flip-chip chip scale packages, advanced chip scale packages, quad flat packages, thin quad flat packages, bump chip carrier, quad flat no-lead packages, advanced quad flat no-lead packages, and plastic BGA. The Testing segment provides complete range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/RF/(2.5D/3D) module and SiP/ MEMS/Discrete and other test-related services. The EMS segment is comprised of the SMT assembly line which provides activities such as, solder paste stencil printing, component placement, and solder reflow. The company was founded in April 2018 and is headquartered in Kaoshiung, Taiwan.
Kaohsiung City, Kaohsiung City
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Markets InsiderMar 8
ASE Technology Holding Co., Ltd. Announces Monthly Net Revenues*
TAIPEI, Taiwan, R.O.C., March 8, 2019 /PRNewswire/ -- ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711, "ASEH" or the "Company"), announces its unaudited consolidated net revenues for February 2019. CONSOLIDATED NET REVENUES (UNAUDITED) Feb Jan Sequential YoY (NT$ Million) 2019 2019 Change Change Net Revenues 26,240 33,056 -20.6% Feb Jan Sequential YoY (US$ Million) 2019 2019 Change Change Net Revenues 853 1,074 -20.6% ...
Expected Apr 26, Pre-Market