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ChipMOS Technologies, Inc. provides total semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers (IDM) and foundries. Its services include testing, assembly, gold bumping, enabling technology, turnkey and eService. Read More The company mainly offer a full range of back-end testing services for high density memory, mixed-signal and flat panel display (FPD) driver semiconductors, in addition it offer a comprehensive selection of leadframe-based and organic substrate-based package assembly services for memory, mixed-signal, and FPD driver semiconductors which are used in diverse end-use markets, including personal computers, communications equipment, office automation and consumer electronics. ChipMOS Technologies was founded on July 28, 1997 and is headquartered in Hsinchu, Taiwan.
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Expected Mar 5, Pre-Market